ge.

| | The PIM chips will be packaged by Cray utilizing its advanced multiple | chip module (MCM) packaging technology that allows the CRAY-3 to operate | with a record breaking 2.08 nanosecond clock rate. The PIM chips are | manufactured by National Semiconductor Corporation. The CRAY-3/SSS is | expected to be demonstrated in the first quarter of 1995. After this | initial demonstration, interested parties will be invited to try out other | applications.

I should note that this is almost 10 times faster than the Coherent Chips. Given that there is no need for interprocessor message passing in the DES tests, I rate that this chip could be 20 times faster than the earlier design. That puts it at 100 days per DES attack. This sounds like a pretty fun machine to get. All of the old vector performance of the Cray bundled with the fun of the old CM-1/CM-2. You could get some _great_ results on specific problems. -Peter Wayner