Many companies(Like Intel) are currently using hafnium oxide to replace silicon dioxide in transistors, due to its high ratio of electric displacement in a medium to the intensity of the electric field producing it, known as a dielectric constant. https://hardware.slashdot.org/story/21/03/25/1930258/samsung-unveils-512gb-d... Hafnium used as a dielectric in intel's chips Açık Çar, Kas 10, 2021 01:16, jim bell <jdb10987@yahoo.com> yazdı:
This includes the notification of the publication of the patent application for the isotopic hafnium dielectric patent.
Instead of using ordinary hafnium in the dielectric under the gates of MOSFET transistors, Hf-177 or Hf-179 isotope hafnium can be used, to increase its dielectric constant.
This will enable the thickening of the dielectric layer from 1.2 nanometers, yet maintain sufficient gate authority. This will enable the continuing shrinkage of feature sizes in cutting-edge IC's.
See:. https://daltonium.com/
F Jim Bell's new patent application.
----- Forwarded Message ----- From: "Daltonium Isotopics" <daltoniumisotopics@gmail.com> To: "jdb10987@yahoo.com" <jdb10987@yahoo.com> Cc: Sent: Tue, Nov 9, 2021 at 1:56 PM Subject: Fwd: Notice of Publication for U.S. Patent Application No. 17/232,016; Our Ref. DAL21301
---------- Forwarded message --------- From: (snip) Date: Mon, Nov 8, 2021, 3:36 PM Subject: Notice of Publication for U.S. Patent Application No. 17/232,016; Our Ref. DAL21301 To: daltoniumisotopics@gmail.com
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Re:
U.S. Utility Patent Application No. 17/232,016
Title: ISOTOPE-MODIFIED HAFNIUM AND SEMICONDUCTOR DIELECTRICS
Our Ref. DAL21301
Good afternoon,
The Notice of Publication of Application has been received from the United States Patent and Trademark Office, informing us that the above-identified patent application was published on October 28, 2021, under Publication Number US-2021-0336027-A1. Copies of the Notice of Publication and the published application are attached for your records.
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